3D-PEIM 2023 aims to enhance 3D manufacturing technology with innovative component design and integration techniques. The event brings together top specialists from a wide range of fields who will be discussing how to design, develop, and manufacture future 3D power electronics systems. The Symposium also covers embedded power modules, packaging materials, passive component integration, multiphysics design tools, integrated voltage regulators, and design for reliability. Sessions will cover mechanical, material, reliability, and manufacturability concerns in the deployment of smart power-dense components and modules. Invited papers will be presented at the conference, which will also feature plenary and keynote talks from academic and business leaders. Several exhibits and an exhibit sponsors session will be present at the Symposium.