Interview with Nick Jones from TE Connectivity

  • Nick Jones - Vice President and General Manager, Performance Materials, TE Connectivity.

everything PE recently interviewed Nick Jones, Vice President and General Manager, Performance Materials, at TE Connectivity. TE Connectivity specializes in designing and manufacturing highly engineered connectivity and sensor solutions.

Q. Can you tell us about TE Connectivity? When was the company formed and what were the objectives?

Nick Jones: For more than 80 years, TE Connectivity (TE) has been engineering and manufacturing products that distribute power, signal, and data through technology that is enabling a safer, sustainable, productive, and connected future. TE Connectivity became an independent, publicly traded company in 2007; however, through our predecessor companies, we trace our foundations in the connectivity business back to 1941. Today, we partner with the world’s innovation leaders to solve tomorrow’s toughest challenges.

Q. What market segments do you cater to? Which segment is the largest for you?

Nick Jones: TE products enable technology in a wide range of industries. We support automotiveindustrialenergydigital data networksmedical, industrial and commercial transportation, aerospace, and smart homes. Automotive is our largest market, accounting for nearly $7 billion in sales in the 2023 fiscal year.

Q. Can you tell us about your product portfolio? What product segment within this portfolio is the largest for you? Which one has been growing the fastest? 

Nick Jones: Our product portfolio is diverse and supports diverse end markets. Our products include terminalsconnector systemssensorsrelaysantennasapplication toolinginterventional medical componentsheat shrink tubingwire, and cable.

Q. Can you tell us about the EMI/EMC solutions offered by TE Connectivity? Which industries benefit the most from TE Connectivity's EMI solutions?

Nick Jones: TE Connectivity offers a comprehensive range of electromagnetic interference (EMI) and electromagnetic compatibility (EMC) solutions designed to help protect electronic devices from interference and help ensure they operate reliably. We offer EMI shielding solutions that include conductive elastomers, knitted wire mesh, oriented wires in silicone, and EMI shielding ventilation panels. These solutions help block or reduce electromagnetic interference. TE also offers EMI gasket solutions used to seal gaps and help prevent EMI leakage. They come in various forms, such as conductive fabric over foam gaskets and beryllium copper fingers.

EMI Shielding Solutions from TE Connectivity

TE Connectivity’s EMI solutions are crucial across various industries, including:

  1. Aerospace and Defense: Helping ensure reliable communication and operation in high-interference environments.
  2. Automotive: Helping protect electronic systems in vehicles from interference, which is critical for safety and performance.
  3. Medical: Helping shield sensitive diagnostic and monitoring equipment from EMI to ensure accurate readings and patient safety.
  4. Industrial Automation: Helping maintain the integrity of automated systems and machinery in factories.
  5. Telecommunications: Helping ensure clear signal transmission and reception in communication devices.
  6. Consumer electronics: Helping protect everyday devices like smartphones, laptops, and home appliances from interference.

These solutions help maintain the performance and reliability of electronic systems in these industries, ensure they meet regulatory standards and function without disruption.

Q. Can you tell us about the EMI shielding solutions specifically designed for power electronics domain by TE Connectivity? 

Nick Jones: TE Connectivity offers a range of EMI shielding solutions specifically designed for the power electronics market. These solutions are developed to address the specific challenges of high-power environments, helping ensure reliable performance and compliance with electromagnetic compatibility standards. Some of the EMI shielding solutions offered for the power electronics market include:

Conductive Elastomers: These are made from silicone or fluorosilicone engineered with highly conductive particles such as silver-plated aluminum, silver-plated copper, nickel-coated graphite, and pure nickel. They provide excellent EMI/RFI shielding performance combined with environmental sealing.

Conductive Elastomers

EMI Gaskets: These include conductive fabric over foam gaskets, knitted wire mesh, and oriented wires in silicone. They are often used to seal gaps and help prevent EMI leakage, ensuring low resistance and galvanic compatibility.

EMI Gasket

EMI Shielding Ventilation Panels: These panels are made from aluminum or steel honeycomb mounted into a frame. They provide effective shielding while allowing airflow to cool power electronics components.

EMI Shielding Ventilation Panels

These solutions offer several benefits including:

  • Enhanced Reliability: By mitigating EMI, these solutions help ensure the reliable operation of power electronics systems, which is critical in applications such as power supplies, inverters, and motor drives.
  • Compliance with Standards: TE Connectivity’s EMI shielding solutions help manufacturers meet stringent EMC regulations and standards, reducing the risk of non-compliance issues.
  • Improved Performance: Effective EMI shielding enhances the overall performance of power electronics by minimizing interference that can affect signal integrity and device functionality.

These solutions are particularly beneficial in industries such as automotive, industrial automation, renewable energy, and aerospace, where power electronics play a crucial role.

Q. Can you discuss any recent advancements or innovations in EMI shielding technology that your company has developed?

Nick Jones: TE has developed new formulations of nickel aluminum conductive elastomers that provide superior EMI/RFI shielding performance combined with excellent environmental sealing. In the medical field, we have focused on creating EMI shielding solutions that help ensure the reliability and precision of critical medical equipment. For example, our materials are used in diagnostic equipment and life-support systems to help prevent signal noise and ensure accurate performance. TE has introduced advanced EMI gaskets and ventilation panels that offer improved shielding effectiveness while maintaining airflow for cooling. These solutions are essential for high-power electronics.

TE’s continuous innovation in EMI shielding technology helps meet the stringent requirements of many industries, ensuring that electronic devices can operate reliably and efficiently in increasingly complex electromagnetic environments.

Q. How does TE Connectivity's EMI shielding materials comply with industry standards and regulations?

Nick Jones: TE Connectivity ensures that its EMI shielding materials can comply with various applicable industry standards and regulations to meet the stringent requirements of different applications. Our products meeting industry standards, such as RoHS (Restriction of Hazardous Substances), REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals), and various MIL-Spec standards such as MIL-DTL38999 for connectors, help ensure they can withstand harsh environments and provide reliable performance.

TE’s EMI Shielding materials also comply with specific industry standards and regulations: for example, automotive standards, such as ISO 11452 for EMC testing of vehicles and components; or aerospace standard DO-160 for environmental conditions and test procedures for airborne equipment, compliance with which is essential in aerospace industry.

By adhering to these standards and regulations, TE ensures that the EMI shielding materials can provide reliable performance and can meet the needs of various industries, from automotive to aerospace and beyond.

About Nick Jones

Nick Jones is the Vice President and General Manager of the Performance Materials Emerging Business Unit, which was recently formed within the Communication segment and Appliance Business unit at the start of FY22. Nick joined TE in 2007 holding several leadership roles including Vice President of Product Management for ICT, VP GM of Industrial Devices, and with Fiber Optic and Antenna business that are now part of the Data and Devices (DND) Business unit. Previously Nick gained broad experience across multiple management, sales, and operational roles at Amphenol Corporation and Pyle National, including AD&M, Industrial, Rail, and Telecom markets.