onsemi, a leader in intelligent power and sensing technologies, will present and demo the company’s latest innovations at electronica in Munich. Visitors of onsemi’s booth 101 in hall C4 at the world’s leading trade fair and conference for electronics will see cutting-edge demos that cover the automotive, industrial, and Cloud power markets. This includes applications in electric vehicles, advanced safety, factory automation, energy infrastructure, and EV charging - with many of them based on silicon carbide (SiC). With an end-to-end SiC supply chain - from volume boule growth to best-in-class integrated modules and discrete package solutions, onsemi provides customers with the supply assurance they rely on.
One key demo will feature innovative top-side cooling MOSFETs that were developed to simplify the thermal design in challenging applications such as motor control and DC/DC conversion. Housed in an LFPAK package measuring just 5 mm x 7 mm, the seven new devices feature a 15 mm2 thermal pad that allows heat to be dissipated directly into a heatsink rather than via the printed circuit board (PCB). This results in lower PCB temperatures, thereby increasing overall system reliability and lifetime. The new concept enables a simplified thermal design and system-level cost savings.
There will also be a new rotary position sensor based on onsemi’s patented dual-inductive technology. This new approach means that the NCS32100 delivers a combination of accuracy, speed, and price. Unlike other solutions, the NCS32100 is simple to use with an integrated M0+ microcontroller (MCU) and firmware that significantly reduces design time and the need for external components, allowing for compact designs to be achieved.
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