Mitsubishi Electric announced that its new SLIMDIP-Z power semiconductor module, featuring an extra-high 30 A rated current for use in inverter systems of home appliances, will be released in February 2023. The compact module will enable the SLIMDIP series to meet a wider range of power and size needs for inverter units, specifically by simplifying and downsizing systems for multifunctional and sophisticated products such as air conditioners, washing machines, and refrigerators.
The demand is growing for power semiconductors capable of efficiently converting electric power to help realize a low-carbon world. In 1997, Mitsubishi Electric commercialized its first DIPIPM as a high-performance intelligent power module with a transfer-mold structure incorporating a switching device and a control IC to drive and protect the switching element. Since then, DIPIPMs have been widely adapted for use in large appliances and inverters for industrial motors, contributing to the downsizing and energy efficiency of inverter boards.
Product Features
Extra-high 30 A rated current will enable simpler, smaller inverter systems for appliances
- Optimized frame shape expands Reverse Conducting IGBT (RC-IGBT) chip’s mounting area.
- Insulation sheet reduces the thermal resistance between chip junction and case by about 40% compared to existing SLIMDIP-L, which allowed the rated current to be increased to 30 A.
- RC-IGBT temperature suppression will help to simplify and downsize the thermal designs of inverter systems.
Click here to learn more about IGBTs from Mitsubishi Electric
