APEC 2024 Announces Call for Technical Program Paper Digest Submissions

APEC 2024 Announces Call for Technical Program Paper Digest Submissions

APEC 2024, to be held in Long Beach, California, from February 25 - 29, 2024, continues the long-standing tradition of addressing issues of immediate and long-term interest to the practicing power electronics engineer. APEC is now accepting paper digest submissions for the Technical Program.

Since APEC 2024 will be held in February rather than the traditional March timeframe, interested authors wishing to present a paper must submit a digest for consideration by July 24, 2023. Instructions for submissions are available at: http://apec-conf.org/conference/sessions/technical/.

Topics of interest are divided into thirteen tracks:

(Single-Phase and Three-Phase Input, Power Factor Correction, CCM, DCM, CRM/BCM Control, Bridgeless, Embedded AC-DC Power Supplies and External AC-DC Adapters, and Bidirectional AC/DC Converters)

(Hard- and Soft-Switched, Resonant Converters, Point-of-Load and Multi-Phase Converters, Voltage Regulator Modules (VRM), and Bidirectional DC/DC Converters)

  • Power Electronics for Utility Interface

(Power Generation, Transmission and Distribution, Power Quality, UPS, Filters, Distributed Energy Systems. SmartGrid, Solid-State Transformers, Metering, and Bidirectional Grid Interface Converters)

(AC, DC, BLDC Motor Drives, Single- and Multi-Phase Inverters, Sensor Integration, Actuators, and High-Performance Drives)

  • Devices and Components

(Power Silicon MOSFETs, BJTs, IGBTs, GaN HEMTs, SiC MOSFETs, and BJTs. Fast Recovery Diodes, Capacitors, Supercapacitors, Interconnects, and Fuses)

  • Power Electronics Integration and Manufacturing

(Power Electronics Packaging, Power Modules / High-Density Design, Thermal and EMC Management, Quality and System Reliability, Embedding Technologies, 3D Packaging, Additive Manufacturing, Production Processes, and Design for Manufacturability)

  • Modeling and Simulation

(Circuits and Systems, Device and Component Modeling, Parasitics, Software Tools, Rapid Prototyping)

  • Control 

(Control of Power Electronic Converters, Current-Mode and Voltage-Mode Control, Digital Control, Sensor and Sensor-less Control, Gate Drive Circuits, Control ICs, MCUs, DSPs, FPGAs, and ASICs)

  • Wireless Power Transfer

(Wireless Charging, Energy Harvesting, Power for IoT, Non-Contact Sensors for Power Electronics)

(Photovoltaic (PV) Inverters and Micro Inverters, Maximum Power Point Tracking (MPPT), Wind Energy Conversion Systems, Fuel Cells, Grid-Tied Systems, Bi-Directional Power Converters, Microgrid Systems, Energy Storage Systems)

  • Transportation Power Electronics

(Vehicular Power Electronic Circuits and Systems, Power Electronics for Hybrid and Electric Cars, Power Electronics for Aerospace, Charging Systems)

  • Power Electronics Applications 

(Lamp Ballasts and LED Lighting, Network and Telecommunication Power Electronics, Defense and Military Power Electronics, AC-DC-AC Applications and Matrix Converters, Portable Power, and Energy Harvesting)

  • Magnetics

(Advanced Magnetic Materials and Geometries, Magnetics Applications, High-Frequency Magnetics, Additive Manufacturing, Magnetics Modeling, and Simulations)

Prospective authors of Technical Program papers are asked to submit a digest explaining the problem that will be addressed by the paper, its major results, and how it is different from the closest existing literature. Technical Program Papers presented at APEC must be original material and not have been previously presented or published. The principal criteria used by reviewers in selecting digests for the program will be the usefulness of the work to the practicing power electronics professional. They also value evidence of completed experimental work. Authors should obtain any necessary company and governmental clearance prior to submission of digests.

Author will be notified of the decision of paper acceptance on September 26, 2023. Accepted papers in final form must be submitted and author registration completed by November 3, 2023

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