
Toshiba Electronic Devices & Storage Corporation has launched two automotive 40 V N-channel power MOSFETs, “XPJR6604PB” and “XPJ1R004PB,” that use Toshiba’s new S-TOGL (Small Transistor Outline Gull-wing Leads) package with U-MOS IX-H process chips.
Safety-critical applications like autonomous driving systems ensure reliability through redundant design, with the result that they integrate more devices and require more mounting space than standard systems. Accordingly, advancing size reductions in automotive equipment require power MOSFETs that can be mounted at high current densities.
XPJR6604PB and XPJ1R004PB use Toshiba’s new S-TOGL package (7.0 mm x 8.44 mm) which features a post-less structure unifying the source connective part and outer leads. A multi-pin structure for the source leads decreases package resistance.
The combination of the S-TOGL package and Toshiba's U-MOS IX-H process achieves a significant On-resistance reduction of 11% against Toshiba's TO-220SM (W) package product, which has the same thermal resistance characteristics. The new package also cuts the required mounting area by approximately 55% against the TO-220SM(W) package. On top of this, the 200 A drain current rating of the new package is higher than Toshiba’s similarly sized DPAK + package (6.5 mm x 9.5 mm), enabling high current flow. Overall, the S-TOGL package realizes high-density and compact layouts, reduces the size of automotive equipment and contributes to high heat dissipation.
Since automotive equipment is used in extreme temperature environments, the reliability of surface mounting solder joints is a critical consideration. The S-TOGL package uses gull-wing leads that reduce mounting stress, improving the reliability of the solder joint.
Assuming that multiple devices will be connected in parallel for applications requiring a higher-current operation, Toshiba supports grouping shipment for the new products, in which the gate threshold voltage is used for grouping. This allows designs using product groups with small characteristic variations.
Toshiba will continue to expand its product line-up of power semiconductor products and contribute to the realization of carbon neutrality with more user-friendly, high-performance power devices.
Key features
- New S-TOGL package: 7.0 mm x 8.44 mm (typ.)
- Large drain current rating
- AEC-Q101 qualified
- IATF 16949/PPAP available
- Low On-resistance
Key specifications
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Key applications
Automotive equipment: inverters, semiconductor relays, load switches, motor drives, etc.
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