Nexperia, a leading provider of power semiconductor solutions, is gearing up to showcase their latest advancements at the upcoming Applied Power Electronics Conference (APEC) 2024 in Long Beach, California. Positioned at Booth #1505, Nexperia invites engineers and industry professionals to explore their cutting-edge technologies and engage in an immersive experience aimed at empowering innovation from engineer to engineer.
Power electronics continue to undergo transformative changes, driven by evolving requirements, technological advancements, and heightened performance expectations across various sectors such as energy management, intelligent motion, and sustainable power. Nexperia recognizes these dynamic shifts and remains at the forefront of innovation, catering to a diverse range of power needs, from low-voltage, low-power applications to robust automotive solutions.
At APEC 2024, Nexperia will unveil a series of live demonstrations showcasing their wide-bandgap FETs, which are setting new standards in performance. Whether it's 100 V, 650 V, or 1200 V applications, Nexperia's latest products promise to power tomorrow's innovations with exceptional reliability and efficiency.
Among the highlights of Nexperia's showcase are:
Exceptional RDS(on) Temperature Stability: Nexperia's first Surface Mount Device (SMD) SiC MOSFETs in an h-bridge configuration promise unparalleled temperature stability, ensuring reliable performance in demanding environments.
Innovative SiC Diodes: Witness the outstanding Figures of Merit (FoM) and virtual zero capacity of Nexperia's 650 V SiC diodes in a DPT/Step-down setup, offering optimized efficiency and reliability.
Benchmarking GaN FET Switching Performance: Explore Nexperia's half-bridge evaluation board designed to showcase the superior switching performance of Enhancement-mode (E-mode) GaN FETs.
In addition to their wide-bandgap FETs, Nexperia will spotlight their integrated solutions for analog and power signaling, catering to the unique demands of IoT and consumer applications. By seamlessly integrating analog and power functions into single ICs, Nexperia aims to enhance system performance while reducing Bill of Materials (BOM) costs, empowering engineers to achieve maximum efficiency in their designs.
Furthermore, Nexperia will showcase their expertise in semiconductor packaging, highlighting industry-standard footprints and innovative packaging technologies designed to optimize power density and performance. Visitors can engage in interactive demonstrations, including a "Fairground Fun Grip Challenge," putting Nexperia's LFPAK packaging to the test.
At the heart of Nexperia's innovation lies its proven power technologies, driving performance and quality across their entire product portfolio. From high-current MOSFETs to low-loss diodes, Nexperia continues to deliver solutions tailored to specific application requirements, ensuring engineers have the tools they need to succeed.
In addition to their product showcase, Nexperia will host a live expo talk on February 27th, focusing on "Double Pulse Testing for Evaluation of Power Devices." This informative session will provide valuable insights and tools for the successful characterization of semiconductor switches, offering practical solutions for testing high-speed Si, GaN, and SiC switches.
As APEC 2024 approaches, Nexperia stands ready to inspire and empower engineers with their latest innovations and expertise, driving progress and innovation in the field of power electronics. Join Nexperia at Booth #1505 and be part of the journey towards a more efficient and sustainable future.
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