
ROHM is encouraging attendees to visit its team at the APEC 2024 conference, BOOTH #913 where the company will showcase its latest solutions and technologies for power applications, automotive, and industrial sectors.
Power is quickly becoming one the most important factors in many areas, driving technological innovation brought on by the need to conserve power as devices and systems consume ever increasing amounts of power in pursuit of greater sophistication and functionality. ROHM has been at the forefront of power in the semiconductor industry for many years, continuously releasing breakthrough products ahead of the competition.
Demo Highlights
- SiC Power Devices
- Power Devices and Gate Drivers
- Evaluation Using the SpeedVal Platform
- EcoGaN solution
- Powered by ROHM (customer demos)
Event Agenda
Exhibitor Sessions
- Presenter: Ming Su, PhD. Technical Marketing Manager, ROHM Semiconductor
TRCDRIVE pack, A Compact High-Power SiC Module for Electric Vehicle Propulsion Systems
Tuesday, February 27, 2024 | 3:00 PM – 3:30 PM | Location: Exhibitor Presentation Theater 3
- Presenter: Kengo Ohmori, Technical Product Marketing Manager, ROHM Semiconductor
High Voltage GaN HEMT (EcoGaN) and SiP Solution for Power Systems
Wednesday, February 28, 2024 | 12:45 PM – 1:15 PM | Location: Exhibitor Presentation Theater 1
Technical Session
- Presenter: Shuichiro Motoori, Engineer, ROHM Semiconductor
T01.8 - Miniaturization of AC-Adapter Realized by Primary Voltage-Clamper with Mid-Voltage (150V) AHB Converter
Tuesday, February 27, 2024 | 11:20 AM – 11:40 AM | Location: 101A
Industry Session
- Presenter: Oji Sato, Group Leader, ROHM Semiconductor
IS23.4 - Achieving Thermal Shock Reliability Enhancement Against Thick Cu Substrate in Die Attach with a High Thermal Conductive Foil
Thursday, February 29, 2024 | 9:45 AM – 10:10 AM | Location: 201B
Dialogue Session
- Presenter: Toshiyuki Zaitsu, PhD, Engineer, ROHM Semiconductor
D02.5 - Compact Hardware Implementation of Power Factor Control for LLC Converter with Event-Driven-Timer Based Digital Controller
Thursday, February 29, 2024 | 11:30 AM – 1:30 PM | Location: Grand Ballroom AB
Click here to view everything PE's complete coverage of APEC 2024.