Semikron Danfoss will be showcasing their cutting-edge power electronics solutions at PCIM Europe 2024, taking place from June 11-13 at the Exhibition Centre in Nuremberg, Germany. Attendees can visit them at Hall 7, Booth 7-459. The event promises a comprehensive display of their industry-leading products and innovations, designed to drive the green transition in various sectors such as industry, e-mobility, and renewables.
Visitors will have the opportunity to meet with Semikron Danfoss experts and explore their robust product portfolio, including the SEMITRANS 20 and SKiiP 4 SiC modules, which are equipped with 2 kV SiC chips from multiple sources. These products enable flexible converter development and reduce time-to-profit for applications requiring high power density.
Key products
- SEMITRANS 20: A next-generation power module for extreme power density applications, offering up to 2 MW of power with 2 kV SiC technology.
- SKiiP 4 SiC: An intelligent power module (IPM) with integrated driver, current sensing, and protection functions, designed for 1500 V applications.
Stage Presentations and Sessions Semikron Danfoss will also be participating in several presentations and sessions during the event:
- First SiC IPM for 1500 VDC-Link Voltage: Presented by Anastasia Schiller on June 11, discussing the benefits of the new SKiiP 4 SiC IPM.
- Increase Power Density & Design Simplicity for 1500 V Applications with 2 kV SiC: Presented by Emiliano Meza on June 12, highlighting the advancements in 2 kV SiC technology for high-power density applications.
- More Compact and Efficient Motor Drives with Silicon Carbide Power Modules: Presented by Carsten Schreiter on June 12, exploring the latest advancements in SiC MOSFETs for motor drives.
- Strong Partnerships in Power Electronics - Why They Matter: Presented by Carsten Schreiter on June 13, emphasizing the importance of sustainable supply strategies and strong partnerships in the semiconductor industry.
Conference Contributions
- An Innovative 3-level Solution for Automotive Application: Pranav Panchal will present on June 12.
- Investigation of Inorganic Encapsulation Materials in Power Electronic Systems for High Power Density Applications: Stefan Behrendt will present on June 12.
- Poster Session: Influence of Transfer Molding on the Reliability of DCM SiC Power Modules: Jacek Rudzki will present on June 12.
- The Design of a 2kV 1700A SiC MOSFET Dual Module: Jorge Mari will present on June 13.
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