Toshiba has announced the mass production of two automotive P-channel power MOSFETs using the TSON Advance (WF) package and has expanded its lineup. The products are -40V "XPN19014MC" and -60V "XPN27016MC." These newly launched power MOSFETs are qualified with the automotive reliability standard AEC-Q101.
The package is a surface mount type TSON Advance (WF) that uses a wettable flank terminal structure, facilitating automated onboard visual inspection. In addition, it has reduced package resistance by adopting the Cu connector structure.
The drain-source On-resistance is specified even under -4.5V measurement conditions, enabling stable operation even during a battery voltage drop. Furthermore, the gate-threshold voltage width is 1.1V, which reduces drain current variance and allows easy control when used in parallel.
Key Features
- AEC-Q101 qualified
- Low On-resistance
- XPN19014MC: RDS(ON)=18.7mΩ (max) (VGS=-10V)
- XPN27016MC: RDS(ON)=27.3mΩ (max) (VGS=-10V)
- TSON Advance (WF) package with a wettable flank terminal structure for easy automated on-board visual inspection
Main Specifications
| Part Number | XPN19014MC
| XPN27016MC
|
| Polarity | P-Channel |
| Absolute Maximum Rating | Drain-source voltage VDSS (V)
| -40 | -60 |
Drain current (DC) ID (A)
| -20 | -25 |
Drain current (pulsed) IDP (A)
| -60 | -50 |
Channel temperature Tch (°C)
| 125 |
Electrical characteristics | Drain-source on-resistance RDS(ON) (mΩ) | VGS=-4.5V | Max | 29.2 |
|
VGS=-10V
| Max | 18.7 |
|
Gate threshold voltage Vth (V) | VDS=-10V
| -1.0 to -2.1 |
Thermal characteristics
| Channel-to-case thermal impedance Zth(ch-c) (°C/W)
| Tc=25°C
| Max | 2.3 | 1.5 |
Key Applications
Click here to learn more about XPN19014MC
