Alpha and Omega Semiconductor has announced the release of its new LFPAK 5 x 6 package, designed to meet the rigorous demands of high-current applications in industries such as industrial power, server infrastructure, solar energy, and telecommunications.
AOS’s LFPAK 5x6 package offers enhanced ruggedness for use in harsh environments without compromising MOSFET performance. Available in a range of voltages including 40 V, 60 V, and 100 V, this new packaging is tailored for high-reliability applications requiring robust performance.
Key features of the LFPAK 5x6 package include gull-wing leads, which improve board-level reliability by enhancing resistance to environmental stress and allowing optical inspection during manufacturing. Additionally, the package’s larger copper clip improves both electrical and thermal performance, enabling superior current handling, reduced on-resistance, and better heat dissipation. The low parasitic inductance further enhances performance in switching applications, reducing spike voltages.
"Designers have long trusted AOS power semiconductors in their applications, and LFPAK 5x6 will expand solution capability," said Peter H. Wilson, Marketing Senior Director of the MOSFET product line at AOS.
Technical Highlights:
- Part Numbers: AOLF66412, AOLF66413, AOLF66417, AOLF66610, AOLF66910
- VDS Range: 40 V to 100 V
- Current Handling: Up to 374 A
- Maximum Junction Temperature: 175°C
- Prices: From $0.78 to $2.10 per unit for 1,000 pieces.
The LFPAK 5x6 family is now available in production quantities with a 14-16 week lead time.
