Flex, a global leader in open computing solutions, is set to showcase its latest innovations at the OCP Global Summit, held at the San Jose Convention Center from October 15–17, 2024. As a key exhibitor, Flex invites attendees to visit booth A11 to explore a range of cutting-edge demos and meet with its expert team.
One highlight of the summit will be Flex's expo floor talk on liquid cooling, scheduled for October 16, 2024, from 9:20 to 9:35 AM at the Expo Hall Stage, Concourse Level. This session will dive into Flex’s innovative approach to liquid cooling solutions, addressing over 80% of data center requirements, from power and cooling to scalability.
Attendees can expect in-depth insights into the following areas:
- Compute and storage server platforms
- Liquid cooling systems
- Vertically integrated racks
- Flex Secure Control Module (DC-SCM2.0)
- Embedded and critical power solutions
- Circular economy initiatives
- Advanced manufacturing and private label components
With a focus on the industry's most pressing challenges, Flex is positioned to demonstrate how its solutions are transforming the future of open computing. Whether you are interested in sustainable data center infrastructure or exploring power and IT advancements, Flex’s presence at OCP Global Summit promises to be a key stop.
