KEMET has introduced its latest product line, the C0G with KONNEKT Series, a new range of multilayer ceramic chip capacitors (MLCCs) designed for both commercial and automotive-grade applications. These surface-mount capacitors are designed for high-efficiency and high-density power applications. KONNEKT high-density packaging technology uses an innovative Transient Liquid Phase Sintering (TLPS) material to create a surface mount multichip solution for high-density packaging. By utilizing KEMET's robust and proprietary C0G base metal electrode (BME) dielectric system, these capacitors are well suited for power converters, inverters, snubbers, and resonators where high efficiency is a primary concern.
With an operating temperature range of up to 125°C, these capacitors can be mounted close to fast-switching semiconductors in high power density applications, which require minimal cooling. C0G with KONNEKT technology also exhibits high mechanical robustness compared to other dielectric technologies, allowing the capacitor to be mounted without the use of metal frames.
C0G with KONNEKT series compliments the KC-LINK with KONNEKT series by offering a wider voltage range and operating temperature range up to 125°C
Key benefits of the C0G Series
- Extremely high power density and ripple current capability
- Extremely low equivalent series resistance (ESR)
- Extremely low equivalent series inductance (ESL)
- Capacitance offerings ranging from 0.78 nF – 2.0 uF
- DC voltage ratings from 10 – 3,000 V
- EIA sizes 1206, 1210, 1812 and 2220
- Operating temperature range of −55°C to +125°C
- No capacitance shift with voltage
- No piezoelectric noise
- High thermal stability
- Surface mountable using standard MLCC reflow profiles
Key applications of the C0G Series
Click here to learn more about the C0G with KONNEKT Series.
