Bosch, a leading provider of semiconductor solutions that make mobility safer, more efficient, and sustainable, will be presenting at APEC 2025, from March 16 - 20, 2025 at Atlanta, Georgia, booth 805. Following their strategy to serve the customers even better and strengthen the footprint in the United States, the company is currently preparing the production ramp-up for silicon carbide semiconductors in Roseville, California. The Roseville wafer fab will allow Bosch to meet the growing demand for SiC chips and to secure the supply chain for local OEMs and automotive suppliers.

The company will be exhibiting the latest developments in SiC technology and the attendees will get a sneak peek at the 3rd generation of SiC semiconductors.

• The latest generations of dual channel SiC trench MOSFETs for 1200 V and 750 V.
• Highly efficient power electronics based on SiC technology, e.g. power modules, power modules on cooler, and the 4th generation of inverters for 400 V and 800 V applications.
• Innovative energy management systems, including bi-directional DC-DC converters and charger-converters
• Isolated HV gate driver portfolio for SiC and IGBT power transistors

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