This webinar discusses the collaborative effort between TDK and Texas Instruments in developing the i3 Micro Module. It showcases how this innovative technology integrates multiple sensors, AI capabilities, and mesh network connectivity to enable straightforward condition-based monitoring of machinery and equipment, particularly in factory environments.
Our Newsletter will keep you up to date with the Power Electronics Industry.
By signing up for our newsletter you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
Create an account on everything PE to get a range of benefits.
By creating an account with us you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
Login to everything PE to download datasheets, white papers and more content.
Fill the form to Download the Media Kit.
Fill the form to Download the Media Kit