1. everything PE
  2. Whitepapers
  3. Assembling eGaN FETs and Integrated Circuits

Assembling eGaN FETs and Integrated Circuits

eGaN® FETs and integrated circuits from EPC have taken a very different approach to packaging power semiconductors – we have ditched the package altogether. EPC’s innovative wafer level, Land Grid Array (LGA) and Ball Grid Array (BGA) packaging has enabled a new state-of-the-art in power density.
Please note: By downloading a white paper, the details of your profile might be shared with the creator of the content and you may be contacted by them directly.
Download Whitepaper