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Thermal Design Challenges at the PCB Level: Identifying the Cause

The most important goal in electronic cooling is to maintain junction temperature (Tj , the temperature) from rising above prescribed levels, since the junction temperature is good predictor of the useful life of the component. From a thermal standpoint, the junction temperature is affected, as with many other electronic components and systems, by the heat generation levels, heat sinking (high conductivity materials, convection cooling, extended surfaces, heat spreading, heat pipes, etc.), ambient temperature, applied interface materials, applied pressures (clamping to reduce thermal contact resistance), among others.
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