The behavior of a semiconductor device depends on the temperature of its silicon chip. This is the reason why electrical parameters are given at a specified temperature. To sustain the performance of a component and avoid failure, the temperature must be limited by controlling the heat transfer between the chip and the ambient atmosphere. The aim of this whitepaper is to provide guidelines on package mounting, handling, and soldering, taking into account thermal requirements (heatsink for through-hole packages, PCB design for surface mount packages components).