This whitepaper explains how Qorvo calculates junction-to-case thermal resistance, for product datasheets and also provides a method for estimating device life given the expected device maximum operating temperature. Qorvo’s product datasheets maximize the utility of IR temperature data, Qorvo’s device reliability estimates are based on thermal simulations, verified by micro-Raman measurements.
Our Newsletter will keep you up to date with the Power Electronics Industry.
By signing up for our newsletter you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
Create an account on everything PE to get a range of benefits.
By creating an account with us you agree to our Terms of Service and acknowledge receipt of our Privacy Policy.
Login to everything PE to download datasheets, white papers and more content.
Fill the form to Download the Media Kit.
Fill the form to Download the Media Kit
