Bourns, a leading manufacturer and supplier of electronic components for power, protection, and sensing solutions, has introduced the CD0201-T2.0LC. It is a bidirectional ultra-low capacitance ESD protection TVS diode capable of handling IEC 61000-4-2 ±12 kV contact discharge and ±15 kV air discharge of ESD pulses. It is constructed in a tiny 0201 package (0.6 mm x 0.3 mm x 0.3 mm), minimizing PCB layout space and easing layout routing for impedance matching. Based on these design features, the Model CD0201-T2.0LC is suitable for ultra-high-speed interface protection including USB 3.0, USB 3.1, USB4, Thunderbolt, DisplayPort, and 10 GbE.
The marketplace continues to seek ultra-low capacitance, and high-performance ESD protection in a compact 0201 package for high-speed communication interfaces. The Bourns Model CD0201-T2.0LC meets designers' needs with its advanced deep snapback design – not only providing the desired ultra-low capacitance but also enhanced ESD protection with high surge current handling capability
Key features
- Bidirectional ESD protection TVS diode
- Ultra-low capacitance: 0.2 pF
- High ESD protection at IEC 61000-4-2:
±12 kV contact discharge
±15 kV air discharge
- 0201 footprint package
- RoHS compliant
- Halogen-free
Key applications
Bourns Model CD0201-T2.0LC offers enhanced protection performance with its ultra-low capacitance and high surge current capability in its compact 0201 footprints. These features meet the electrical and physical ESD protection requirements of ultra-high-speed data interface protocols including USB 3.0, USB 3.1, USB4, Thunderbolt, DisplayPort, and 10GbE. It is important to note, however, that Model CD0201-T2.0LC is not recommended for use as DC supply line protection. In addition, this new Bourns ESD protection TVS diode is capable of handling 7 A of surge current (8/20 µs) and provides superior clamping voltage performance as low as 4 V.
As advanced semiconductors continue to be susceptible to pulse surges, reliable ESD protection is essential for ultra-high-speed data communication interfaces. Designers of next-generation applications are also further challenged by the need for ever-smaller protection solutions in increasingly complex, space-constrained, and densely populated PCB layouts.
