TDG650E60BEPF

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TDG650E60BEPF Image

The TDG650E60BEPF from Teledyne e2v HiRel Electronics is an Enhancement Mode GaN Transistor that is ideal for high-efficiency power conversion, high-density power conversion, AC-DC converters, bridgeless totem-pole PFC, ZVS phase shifted full bridge, half & full bridge topologies, synchronous buck or boost, uninterruptable power supplies, motor drives, single and three phase inverter legs, solar and wind power, fast battery charging, DC-DC converters, on-board battery chargers and e-switch applications. This transistor has a drain-source voltage of up to 650 V, a gate threshold voltage of less than 1.7 V, and a drain-source on-resistance of 25 milli-ohms. It has a continuous drain current of up to 60 A and a pulsed drain current of less than 120 A. This normally-off transistor is designed with a low inductance GaNPX package and has an ultra-low FOM die which nullifies reverse recovery current loss which makes it ideal for high switching applications. It has simple gate requirements and has fast and controllable fall and rise times. This RoHS 3 (6+4) compliant GaN transistor has reverse current capability and has dual gate pads for optimal board layout. It is available in a surface-mount package that measures 11.02 x 9.02 mm.

Product Specifications

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Product Details

  • Part Number
    TDG650E60BEPF
  • Manufacturer
    Teledyne e2v HiRel Electronics
  • Description
    650 V E-mode GaN transistor for Power Conversion Applications

General

  • Configuration
    Single
  • Industry
    Commercial, Industrial
  • Gate Threshold Voltage
    1.7 V
  • Drain Source Voltage
    650 V
  • Drain Source Resistance
    25 milli-ohm
  • Continous Drain Current
    60 A
  • Pulsed Drain Current
    120 A
  • Total Charge
    14.2 nC
  • Input Capacitance
    518 pF
  • Output Capacitance
    126 pF
  • Turn-on Delay Time
    4.6 ns
  • Turn-off Delay Time
    14.9 ns
  • Rise Time
    12.4 ns
  • Fall Time
    22 ns
  • Temperature operating range
    -55 to 150 Degree C
  • RoHS Compliant
    Yes
  • Package Type
    Surface Mount
  • Applications
    High efficiency power conversion, High density power conversion, ac-dc Converters, Bridgeless Totem Pole PFC, ZVS Phase Shifted Full Bridge, Half & Full Bridge topologies, Synchronous Buck or Boost, Uninterruptable Power Supplies, Motor Drives, Single and
  • Dimensions
    11.02 x 9.02 mm

Technical Documents

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